Electrodeposited Copper Foil Market to Grow at 11.61% CAGR – What’s Next?

Global Electrodeposited Copper Foil Market Poised for Significant Growth

The Global Electrodeposited Copper Foil Market is on a trajectory of substantial expansion, driven by escalating demand from the electronics and electric vehicle (EV) sectors. Valued at approximately US$ 12.74 billion in 2023, the market is projected to reach around US$ 27.49 billion by 2030, exhibiting a Compound Annual Growth Rate (CAGR) of 11.61% during the forecast period.

Competitive Landscape

The market is characterized by intense competition, with key players such as Furukawa Electric Co., Ltd., Iljin Materials Co., Ltd., and Nippon Denkai, Ltd. leading the charge. These companies are actively investing in research and development to innovate and meet the evolving demands of various industries.

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Regional Demand Highlights

The Asia-Pacific region dominates the electrodeposited copper foil market, attributed to rapid industrialization and the burgeoning electronics manufacturing sector. North America and Europe also present significant demand, propelled by advancements in technology and the growing adoption of electric vehicles.

Segmentation Analysis

by Thickness

< 20um
20um – 50um
> 50um

Three categories comprise the electrodeposited copper foil market: less than (<) 20um, 20um to 50um, and larger than (>) 50um. The less than (<) 20um category dominated the market in 2023, accounting for 43.24% of total revenue. As the amount of copper utilized declines, less copper is used for micro-thin chip recycling and reuse, which saves resources and propels market expansion. Thinner electrodeposited copper foil saves energy and resources since it requires less energy to produce and transport.

by Application

Printed circuit boards
Switchgear
EMI shielding
Batteries
Others

The printed circuit boards category dominated the market in 2023, accounting for approximately 62% of total revenue. Copper improves the ability of printed circuit boards (PCBs) to conduct heat along and across them. It also lessens the stress that uneven PCB heating causes, which can result in failure. It can also send electrical impulses instantly because of its great electrical conductivity.

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Key Market Participants:

1. Doosan Group
2. ENEOS Holdings Inc.
3. Fukuda Metal Foil & Powder Co. Ltd.
4. Furukawa Electric Co. Ltd.
5. Iljin Materials Co. Ltd.
6. Mitsui Mining & Smelting Co. Ltd
7. Rogers Corporation
8. SKC
9. Sumitomo Metal Mining Co. Ltd
10.Targray Technology International Inc.
11.UACJ Foil Corporation
12.Hitachi Cable
13.JX Nippon Mining & Metal
14.Olin Brass
15.Amari Copper Alloy Ltd.
16.Acrotech Ltd.
17.Kingboard Copper Foil Holdings Ltd
18.Nan Ya Plastics Corp.
19.Minerex AG
20.LS Mtron Ltd
21.Jiangxi Copper Corporation
22.Circuit Foil Luxembourg
23.Shandong Jinbao Electronics Co. Ltd.
24.LingBao Wason Copper Foil Co. Ltd.
25.Guangdong Chaohua Technology Co. Ltd.
26.Others

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